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Electronic Device Failure Analysis

 

Published Papers

Papers are in PDF format.

Processes For Thinning And Polishing Highly Warped Die To A Nearly Consistent Thickness: Part 1; EDFA November 2022

Processes For Thinning And Polishing Highly Warped Die To A Nearly Consistent Thickness: Part 2; EDFA February 2023

OmegaPrep - The Final Word in Sample Preparation

A Process For Thinning And Polishing Highly Warped Die To High Surface Quality
And Consistent Thickness: Part 1; EDFA 2015

Thinning And Polishing Highly Warped Die: Part 2
A Discussion Of The Mechanical Limitations Of Flattening A Curved Die
In Preparation For Die Thinning; EDFA 2015

A Discussion Of The Mechanical Limitations Of Machinery Used For Sample-Preparation Processes; EDFA 2016